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电子工艺
干货分享:元器件封装选型的9大技术要点
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干货分享:元器件封装选型的9大技术要点
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998巢币
4990巢币
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365 天(随到随学)
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课程介绍
感谢您使用电巢APP, PC端建议使用Google Chrome浏览器进行观看!
讲师介绍:
严春美老师
|EDA365论坛特邀版主,原华为研发工艺技术专家
10多年专注通讯基站产品的单板工艺DFX设计和端到端交付,支持单板稳定交付数量达千万级;
在产品研发阶段的可制造性设计、工艺可靠性设计、以及工艺设计流程和规范完善方面积累了丰富的经验;
曾被评为华为金牌个人奖、总裁个人奖。
课程介绍:
元器件的封装选型不仅影响组装工艺的选择和设计、更影响焊点质量可靠性。工程师如何对元器件进行封装选型?本课结合具体案例、分享了元器件的封装选型
9项技术关键点,帮助工程师快速掌握封装选型的方法。
课程要点:
元器件封装选型的
9大技术关键点
适合对象:
硬件工程师
工艺工程师
质量工程师
采购工程师
电气工程、电力电子相关专业学生
目录
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试看
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回放
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正在直播中
直播结束
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预览
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购买
免费
试看
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