国产芯片封装及PCB设计 RedEDA软件首秀

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国产芯片封装及PCB设计 RedEDA软件首秀

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课程介绍

感谢您使用电巢APP， PC端建议使用Google Chrome浏览器进行观看！

吴声誉老师

原华为互连GSM部门经理

现任上海弘快科技发展有限公司总经理

原华为互连GSM部门经理，负责华为GSM基站PCB板设计仿真团队，长期从事芯片封装基板及PCB的设计仿真工作。现任上海弘快科技发展有限公司总经理，带领团队开发国产芯片封装和PCB设计RedEDA软件。

毛忠宇老师

原国内知名企业高速信号仿真及SIP设计专家

EDA365信号完整性、仿真SI/PI论坛特邀版主

20多年深耕电子科技行业，主要领域包括，信号/电源完整性仿真与平台建设、高速芯片封装设计、PCB-封装-芯片协同设计。

个人主要出版物：

《信号、电源完整性仿真设计与高速产品应用实例》

《IC封装基础与工程设计实例》

《华为研发14载.那些一起奋斗过的互连岁月》

直播内容简介

国际形势，风起云涌。突如其来的贸易争端，打破了科技市场的平静。尤其是EDA软件的种种限制，令我们如鲠在喉。在这种困难的环境下，弘快团队带着国人的期望和行业的期待，迎难而上，克服种种困难，于10月1日成功发布RedEDA V1.0版本，经过客户的测试反应良好，特联合电巢直播，于12月14晚20：00向业界EDA用户展示，欢迎大家观看。

直播要点

PCB和Package技术分享

RedEDA软件开发方向规划

RedEDA相关问答讨论

适合对象

PCB设计工程师

EDA工程师

硬件工程师

电子相关专业学生

芯片设计工程师

芯片封装设计工程师

电路设计工程师

电子设计工程

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