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器件工程管理
FPGA国产化的竞争力和选型(二)
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FPGA国产化的竞争力和选型(二)
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讲师介绍
荣庆安
EDA365论坛特邀版主
原华为器件可靠性技术首席专家
原华为器件可靠性技术首席专家、器件工程专家组主任、器件归一化工作奠基人。20多年交换机、路由器、传输、基站等产品器件工程设计。主持多项重大失效问题攻关,完成了逻辑、储存、光器件等领域器件优选库建设。参与中国器件标准工作,国内外发表论文4篇,获器件相关6项发明专利。
课程介绍:
FPGA属于集成电路中的重要门类,与CPU、存储器、
DSP
并称四大通用集成电路芯片,是半导体行业无法缺少的一环。 近些年,中国电子产品与国外领先企业产品的差距越来越小,国产FPGA虽在工艺制程,高速,门电路资源等方面落后,但追赶进度较快。
本期课程主要从FPGA研发疫情产品(口罩设备,红外测温仪),FPGA岗位薪酬切入,介绍FPGA器件基本知识,包括FPGA历史,器件特点,主流器件结构,应用,FPGA设计流程,器件配置,上下电顺序要求,设计注意事项,FPGA发展趋势,及FPGA 基础入门到精通建议。
课程要点:
FPGA供应链:FABLESS模式运营(Intel是IDM模式),代工,封装,测试等。
FPGA市场:FPGA市场,2023年约100亿$,中国将超过30%份额。未来国产替代或将百亿机会。
FPGA竞争格局:FPGA与CPU,GPU等在传统行业,及新型如AI,大数据,云计算,汽车等竞争格局。
FPGA厂家:国内外FPGA厂家对比分析,包括国内厂家性能,软件,替代与创新,技术标准,可靠性等差距与机会。
目录
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