芯片从设计到测试，如何应对2.5D/3D验证的挑战

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芯片从设计到测试，如何应对2.5D/3D验证的挑战

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课程介绍

感谢您使用电巢APP，PC端建议使用Google Chrome进行观看。

讲师介绍：

荣庆安老师|EDA365论坛特邀版主，原华为器件可靠性技术首席专家

原华为器件可靠性技术首席专家、器件工程专家组主任、器件归一化工作奠基人；
20多年交换机、路由器、传输、基站等产品器件工程设计；
主持多项重大失效问题攻关，完成了逻辑、储存、光器件等领域器件优选库建设；
参与中国器件标准工作，国内外发表论文4篇，获器件相关6项发明专利。

张凌云应用工程师经理

2006年加入西门子EDA（原Mentor），负责先进验证技术的应用推广和咨询服务。在从业集成电路设计和验证的二十多年里，设计或支持了从180nm到5nm的大量芯片，为芯片的成功流片提供了专业的咨询服务和技术支持，在超大规模集成电路的设计、仿真、物理验证以及可靠性验证等方面积累了丰富的经验。在加入西门子EDA之前，他专业于集成电路混合信号设计与仿真，精通模拟电路设计、数/模混合电路的设计与仿真，版图物理设计及验证整个流程。

闵潇文应用工程师

毕业于荷兰埃因霍芬理工大学，取得混合信号微电子工学硕士学位。2018年加入Siemens EDA，成为电子板级系统部门的应用工程师。在PCB设计、封装、SI/PI仿真方面拥有丰富的经验，专注于负责亚太区大客户的先进技术导入。

直播内容简介

封装技术的发展
3D异构 IC的介绍及技术挑战
Siemens EDA的全面技术解决方案

直播要点

随着2.5D/3D IC设计的新技术带来新的挑战，公司和设计团队都必须面对并加以克服。这些挑战包含验证及确认、以制造为主的实作及多基板/device架构。多晶粒(multi-die) 3D IC封装成为形成产品差异化与竞争力的重要体现。
而机遇往往与挑战相伴，在3D IC封装需求日渐迅猛的当下，面临的挑战自然也是一重又一重，其中最根本的挑战来自于应用工具数据库的转变。芯片通用的GDS格式与PCB使用的Gerber格式有着根本上的差别，需要重新整合解决方案，以满足先进封装要求。此外，规模增长带来的复杂性也是需要重点关注的问题。在做2.5D/3D IC时，面对日益庞大的系统，需要考虑能否承担并验证。

2.5D/3D IC的设计规划，对于系统的统一管理
2.5D/3D IC的Layout，高密度复杂设计的挑战实现
2.5D/3D IC的仿真及验证，保障系统的质量

适合对象

3D IC设计工程师
3D IC仿真验证工程师
关注3D IC的工程师

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