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老师工程专业及从业经验介绍
Dr. WWK has a PhD from an IVY league school and Post-Doc from Carnegie-Mellon University. He has over 35-year experience in R&D and product development for microelectronics and semiconductor materials, processes, and devices. He worked for a large aerospace electronics company and a leading mobile device OEM company for over two decades. He has published nearly 100 papers and presentations, and over 30 patents on microelectronics assembly and devices. In the area of semiconductor backend packaging technology, he worked on flip chip assembly, ball grid array and chip scale package development, followed with wafer level packaging technologies including copper pillar bumping, 2.5D and 3D high density advanced packages and high-density multichip modules and system in packages.
WWK博士拥有常春藤盟校的博士学位和卡内基梅隆大学的博士后 经历。他在微电子和半导体材料、工艺和设备的研发和产品开发方面拥有超过35年的经验。他在一家大型航空电子公司和一家领先的移动设备OEM公司工作了20多年。他发表了近100篇论文和演讲，并在微电子组装和器件方面获得了30多项专利。在半导体后端封装技术领域，他从事倒装芯片组装、球栅阵列和芯片级封装开发，随后从事晶圆级封装技术，包括铜柱凸点、2.5D和3D高密度高级封装以及高密度多芯片模块和系统封装。
课程目标：
Understand and obtain holistic basic knowledge on the progress of semiconductor packaging technology and processes, materials; and OSAT functions and supply chain ecosystem; help engineers improving and gaining knowledge on backend packaging design, materials, process and trends in high performance advanced packaging technology.
了解并获得关于半导体封装技术和工艺、材料进展的整体基础知识；以及OSAT功能和供应链生态系统；帮助工程师改进和获取有关后端封装设计、材料、工艺和高性能先进封装技术趋势的知识。
学习对象：
IC Packaging R&D engineers 集成电路封装研发工程师
IC package design engineers 集成电路封装设计工程师
IC packaging process and manufacturing 集成电路封装工艺与制造工程师
IC packaging materials technologists 集成电路封装材料技术专家
Packaging and assembly reliability engineers封装和组装可靠性工程师
SMT assembly process engineers SMT 组装工艺工程师
Semiconductor fab frontend engineers 半导体晶圆厂前端工程师
Entry level college and graduate level students想要了解封装技术的大学生和研究生
课程简介：
- Fundamentals in IC packaging design, materials, and processes
- Packaging types and classifications: lead frame, array, chip size, wafer level, and panel level
- Packaging enabling technologies: bumping, CPB, flip chip, substrate, underfill, equipment and processes
- Wafer level fan-out and panel level fan-out packages
- System in package (SiP), package on package (PoP), 2,5D and 3D heterogeneous integration (HI)
- Package materials and assembly
- Chip-package interaction (CPI) and reliability
- High density advanced packaging and emerging chiplet technology
• IC 封装设计、材料和工艺的基础知识
• 封装类型和分类：引线框架、阵列、芯片尺寸、晶圆级和面板级
• 封装支持技术：凸点、CPB、倒装芯片、基板、底部填充、设备和工艺
• 晶圆级扇出和面板级扇出封装
• 系统级封装 (SiP)、封装上封装 (PoP)、2,5D 和 3D 异构集成 (HI)
• 封装材料和组装
• 芯片封装交互 (CPI) 和可靠性
• 高密度先进封装和新兴的小芯片技术
课程特色：
- Comprehensive review and discussion over entire spectrum of packaging technology
- Includes fundamental knowledges, current trends, and most advanced technology outlook
- Summaries and tips based on personal experience and knowledge
- Easy to understand, from basics fundamental concepts to advanced design, assembly, and processes
- Help native engineers to learn and understand the use of important and frequently used English terminologies and special terms
• 对整个封装技术，进行全面的审视和讨论
• 包括基础知识、当前趋势和最先进的技术展望
• 基于个人经验和知识给出总结和提示
• 易于理解，从基本概念讲起，并逐步推进到先进的设计、组装和工艺流程
• 帮助本地工程师学习和理解，重要的和常用的英语 特殊 专业 术语，以及特殊术语的使用
授课教师
