电子封装材料与失效案例分析

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电子封装材料与失效案例分析

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课程介绍

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讲师介绍：

王永坤|博士，西安电子科技大学副教授/硕导，西安电子科技大学机电工程学院院长助理。

2014年12月毕业于西北工业大学，2015年1月入职到西安电子科技大学电子封装技术专业工作。2018年11月-2019年12月，挂职于CEC中国振华电子集团永光电子有限公司任科技副总，2020年7月-2021年8月，挂职于无锡国家集成电路设计基地有限公司任副总经理。多年来一直从事电子封装材料与封装可靠性的研究，作为项目负责人先后主持国家自然科学基金，中国博士后一等资助基金，陕西省自然科学基金在内的科研项目8项，参与封装器件可靠性方面的国家级项目多项，以第一作者或通讯作者发表SCI收录论文18篇，授权发明专利5项，获陕西省高等学校科学研究一等奖1项。

课程介绍：

现代电子信息技术飞速发展，电子产品向小型化、便携化、多功能化方向发展。电子封装材料是用于承载电子元器件及其相互联线，起机械支持，密封环境保护，信号传递，散热和屏蔽等作用的基体材料。电子封装材料和技术使电子器件最终成为有功能的产品。电子封装正在与电子设计和制造一起，共同推动着信息化社会的发展。

理想的电子封装材料必须满足以下基本要求:

低的热膨胀系数;
导热性能好；
气密性好；
强度和刚度高；
良好的加工成型和焊接性能；
对于应用于航空航天领域及其他便携式电子器件中的电子封装材料的密度要求尽可能的小，以减轻器件的质量。

本场直播，西安电子科技大学副教授/硕导王永坤博士，将会为大家详细介绍电子封装技术及封装材料特性，通过实际封装失效案例分析失效机理，从多个角度去分析缺陷产生的原因。

直播要点：

西安电子科技大学-电子封装技术专业
电子封装材料及功能特性对比
电子封装材料的发展趋势
封装失效机理及案例分析

适合对象：

硬件工程师
器件工程师
质量/可靠性工程师
电气工程、电力电子相关专业学生

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电子封装材料与失效案例分析

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